| SES # | TOPICS | ASSIGNMENTS |
|---|---|---|
| 1 | Introduction — processes and variation framework | |
| 2 | Semiconductor process variation | Assignment 1 out |
| 3 | Mechanical process variation — physical causes and interpreting data | |
| 4 | Probability models of manufacturing processes | Assignment 1 due, assignment 2 out |
| 5 | Probability models, parameter estimation, and sampling | |
| 6 | Sampling distributions and statistical hypotheses | Assignment 2 due, assignment 3 out |
| 7 | Shewhart SPC and process capability | |
| 8 | Process capability and alternative SPC methods | Assignment 3 due, assignment 4 out |
| 9 | Advanced and multivariate SPC | |
| 10 | Yield modeling | Assignment 4 due, assignment 5 out |
Quiz 1 (covers through Ses #9) | ||
| 11 | Introduction to analysis of variance | |
| 12 | Full factorial models | Assignment 5 due, assignment 6 out |
| 13 | Modeling testing and fractional factorial models | |
| 14 | Aliasing and higher order models | Assignment 6 due, assignment 7 out |
| 15 | Response surface modeling and process optimization | |
| 16 | Process robustness | Assignment 7 due, assignment 8 out |
| 17 | Nested variance components | |
| 18 | Sequential experimentation: "Experimentation and Robust Design and Engineering Systems." | Assignment 8 due |
Quiz 2 | ||
| 19 | Case study 1: tungsten CVD DOE/RSM | Project proposal due |
| 20 | Case study 2: cycle to cycle control | |
| 21 | Case study 3: spatial modeling | Project meeting due |
| 22 | Case study 4: "Modeling the Embossing/Imprinting of Thermoplastic Layers." | |
| 23 | Project presentations 1 | |
| 24 | Project presentations 2 | |
